Panduit- StructuredGround™ Telecommunications Main Grounding Busbar

  PANDUIT EARTH GROUNDING SYSTEM STUCTUREDGROUND™ TELECOMMUNICATIONS MAIN GROUNDING BUSBAR  

FEATURES

  • Central power grounding bar

  • Provides a common grounding point in telecom rooms or MDF/IDFs, simplifying bonding of telecom and power equipment.

  • Pre-drilled for flexibility

  • Multiple 3/8″ and 1/4″ holes accommodate a range of grounding connectors and grounding jumpers without modification.

  • Robust construction

  • Made from solid copper bar with tin plating to resist corrosion and ensure long-term conductivity.

SPECIFICATIONS

  • Example Part Number: GB4B0624TPI‑1

  • Bar Dimensions: 20″ (508 mm) × 4″ (101.6 mm) × ¼″ (6.4 mm)

  • Hole Count / Pattern: 24 × ¼″ holes and 6 × 3/8″ holes; 5/8″ and 1″ spacing

  • Voltage Rating: 600 VAC

  • Material: High-conductivity copper, tin-plated

  • Standards / Listing: Meets BICSI / J-STD-607-A grounding requirements, cULus listing for grounding & bonding

  • Insulator Voltage Rating: 600 V

  • Intended Application: Main grounding busbar for telecommunications / data center bonding systems

  • Mounting: Includes mounting brackets and insulating hardware for safe installation

  PANDUIT EARTH GROUNDING SYSTEM STUCTUREDGROUND™ GB4A GROUNDING BUSBAR  

FEATURES

  • Versatile grounding solution

  • Provides 4-hole lug mounting space suitable for telecom, data center, or industrial applications.

  • Easy mounting options

  • Can be mounted directly to backboards or panels with standard hardware.

  • Heavy-duty build

  • Constructed from high-conductivity copper with tin plating for corrosion protection.

SPECIFICATIONS

  • Material: Copper

  • Finish: Tin‑plated

  • Voltage Rating: 600 VAC

  • Width: 4 in (101.6 mm)

  • Length (Example – GB4B0612): 12 in (304.8 mm)

  • Thickness / Bar Height: ~¼ in (~6.4 mm)

  • Mounting Hole Count: 18 (for 12‑inch version)

  • Standards: BICSI / TIA‑607, cULus listed

  • Application: Telecommunication / data center grounding (common bonding)

  • Pre‑assembled Hardware: Includes brackets and insulators for mounting

  PANDUIT EARTH GROUNDING SYSTEM STUCTUREDGROUND™ GB2D GROUNDING BUSBAR  

FEATURES

  • High-capacity grounding bar

  • Designed in the classic “D-pattern” shape, with up to 33 mounting holes—perfect for heavy-duty grounding in control panels or distribution systems.

  • Corrosion-resistant copper

  • Constructed from high-conductivity tin-plated copper, ensuring reliable electrical contact and extended lifespan.

  • Ready for installations

  • Pre-assembled brackets and insulators reduce installation time and provide quick rack or panel integration.

SPECIFICATIONS

  • Part Number Example: GB2D0056TPI‑1

  • Material: Copper, tin-plated

  • Length: 60 in (1,524 mm)

  • Bar Width: 2 in (50.8 mm)

  • Bar Height (Thickness): ~2.75 in / 69.9 mm (this is height of the bar structure, not thickness)

  • Stud Hole Size: 0.44 in (~11.1 mm)

  • Standards: BICSI / TIA‑607, NEMA pattern, cULus Listing

  • Voltage Rating: 600 V (per data sheet)

  • Application: Telecommunications / data center grounding as main bonding busbar

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