Lenovo - ThinkSystem SR675 V3

  LENOVO RACK SERVER THINKSYSTEM SR675 V3   

FEATURES

• GPU-optimized 3U platform for AI / HPC / accelerator workloads

• Designed to host multiple GPUs and provide high throughput for AI, inference, and compute-intensive tasks.

• Support for up to 8 double-width GPUs with NVLink / NVIDIA HGX

• Built to scale with modern accelerators; supports configurations like HGX H100 and modular cooling.

• AMD EPYC 9004 / 9005 (Genoa / Genoa+) support with scalable memory

• Supports 4th and 5th generation AMD EPYC processors, leveraging the memory and I/O capacity needed by GPU clusters.

• Hybrid liquid-to-air cooling (Lenovo Neptune)

• To manage thermal loads from GPUs, the cooling combines liquid and air paths, enabling dense GPU deployments.

• Modular design & front / rear network flexibility

• Offers design flexibility so that front or rear high-speed networking and drive configurations can be chosen.

SPECIFICATIONS

• Form Factor: 3U rack server

• Processor Support: 1 or 2 × AMD EPYC 9004 / 9005 series processors

• GPU / Accelerator Support: Up to 8 double-width GPUs, support for HGX H100 configurations with NVLink & Neptune cooling

• Memory / DIMMs: Supports 24 DDR5 DIMMs (12 channels per CPU)

• Storage: Supports high-speed NVMe, SAS, SATA in flexible drive slot configurations

• Cooling: Hybrid liquid-to-air cooling (Lenovo Neptune) for GPU configurations

• Expansion / I/O: Modular risers, support for high-speed networking front or rear placements

• Power Supplies: Redundant options with capacity to support CPU + GPU loads

  LENOVO RACK SERVER THINKSYSTEM SR685A V3  

FEATURES

• 8U, 2-socket GPU / AI / HPC rack design

• Built to host heavy compute workloads, including large GPU deployments, in an 8U form.

• Support for 4th & 5th Generation AMD EPYC processors

• Offers flexibility with AMD EPYC “Genoa” (4th Gen) and “Turin” (5th Gen) processors, enabling high core counts and performance scaling.

• High GPU / accelerator capacity

• Supports up to 8 GPUs (AMD Instinct MI300X or NVIDIA H100/H200), fully interconnected with NVLink or Infinity Fabric for high bandwidth GPU-to-GPU traffic.

• Advanced I/O and interconnect

• Includes PCIe Gen5 lanes, high-throughput interconnects (NVLink / Infinity Fabric), and fast links between CPU, GPU, memory, and I/O.

• Enterprise-grade manageability & security

• Supports Lenovo XClarity, firmware integrity, root-of-trust, diagnostics, monitoring, and hardware security features.

SPECIFICATIONS

• Form Factor: 8U rack, 2-socket server

• Processor Support: 2 × AMD EPYC 9004 / 9005 (Genoa / Turin)

• Memory / DIMMs: Up to 24 DDR5 DIMMs (24 channels total)

• Maximum Memory: Up to ~3 TB using high-capacity DIMMs

• GPU / Accelerator Support: Up to 8 GPUs (AMD MI300X or NVIDIA H100 / H200) with NVLink / Infinity Fabric interconnects

• I/O & Interconnect: PCIe Gen5, NVLink / Infinity Fabric, high-bandwidth paths between subsystems

• Storage / Drive Support: Supports high performance storage via NVMe, SAS/SATA, possibly any-bay style configurations (dependent on model)

• Power / Cooling: Redundant hot-swap power supplies; cooling engineered for high heat loads in GPU configurations

• Dimensions / Weight: (not fully in search sources) — derived from spec / data sheet (8U height)

• Management & Security: Lenovo XClarity, firmware protections, diagnostics, root-of-trust features

  LENOVO RACK SERVER THINKSYSTEM SR635 V3  

FEATURES

• Ultra-high-density single-socket 1U rack server

• Designed to deliver maximum compute in a compact 1U chassis, it supports a single processor (4th or 5th Generation AMD EPYC) with up to 160 cores—ideal for virtualization, software-defined infrastructure, or dense data-centre deployments.

• Flexible, high-performance storage and I/O with AnyBay™ support

• Offers up to 12 × 2.5″ hot-swap drive bays (or up to 16 × EDSFF) plus optional rear boot M.2 drives. I/O options include up to five PCIe 4.0 slots or up to two PCIe 5.0 slots for next-gen accelerators and NVMe storage.

• Advanced memory architecture for data-intensive workloads

• With 12 TruDDR5 DIMM slots (one per channel) and support for high-speed memory (up to 6400 MHz with 5th Gen EPYC), it enables large-scale in-memory compute and fast data access.

• Enterprise-grade infrastructure, reliability & management

• Includes hot-swap redundant fans and power supplies, supports liquid-cooling options, features the XClarity Controller 2 (XCC2) for remote management, and boasts full server-class security features like TPM, Root of Trust and firmware resiliency.

• Optimised for high-performance workloads and benchmarks

• The server has achieved benchmark-record results (e.g., SPEC CPU2017, SPECpower) in its class, demonstrating industry-leading performance per watt for single-socket servers.
  

SPECIFICATIONS

• Form Factor: 1U rack server, depth ~ 778 mm

• Processor Support: 1 × AMD EPYC 9004 / 9005 series

• Core / Threads: Up to 128 cores in certain configurations

• Memory / DIMMs: 12 × TruDDR5 DIMM slots (1 DIMM per channel)

• Maximum Memory: Up to 3 TB using high-capacity DIMMs

• Drive Bays:

•  • Up to 12 × 2.5" hot-swap SAS / SATA / NVMe

•  • Support for EDSFF drives (up to 16 in some configs)

•  • Boot drives: two 7mm drives at rear; internal M.2 module option

• GPU Support: Up to 4 single-width GPUs

• Expansion / Slots: Up to 5 PCIe slots (mix of Gen4 / Gen5)

• Network / I/O: OCP 3.0 mezzanine adapter, 1 GbE dedicated management port, optional additional ports via OCP or PCIe.

• Power / Cooling: Dual redundant AC / DC power supplies (Titanium / Platinum options)

• Management & Security: ThinkSystem XClarity Controller, TPM, firmware security, embedded diagnostics